The iPhone 12 (or whatever the family will be called in 2020) should be the first Apple smartphone to support 5G, thanks to Qualcomm's Snapdragon X55 modems. However, the inclusion of this technology will lead to a increase in costs and surface of motherboards, according to Ming-chi Kuo.
TF Securities analyst predicts that the size of the card will increase overall 10% approximately, due to the need for additional expedients for heat dissipation and new circuits for connecting the 5G antenna. Between new antenna and new motherboard, the production cost of an iPhone could increase by about 35 dollars. Among the suppliers involved in the creation of the new chips would be Avary, EMC and AT&S, all long-time collaborators of Apple.
Ming-chi Kuo also said earlier that the new network technology would require the realization of a more sophisticated metal frame, precisely because of the need for a greater number of "openings" to pass the antennas (the metal greatly compromises the reception, so there must be bands in other materials, generally plastic, to ensure that the device can connect to the networks at its maximum capacity).
Could return (always speaking of the frame, be it clear) a design similar to that of the iPhone 4 – we hope net of the famous and infamous "hand effect". Consequently, even the production cost of this component could increase considerably: up to + 50-60% for the body itself, + 40-50% for the glass coating (the percentages go down respectively to + 25-35 % and + 20-30% in case of tempered glass for coating).